Showing posts with label chip. Show all posts
Showing posts with label chip. Show all posts

Friday, July 24, 2020

Novel Technology Extends Battery Life, Increases Upload Speed, and Reduces Data Corruption


Memory devices come in many forms. From USB sticks, to external hard-drives, to chips implanted directly into smartphones. What makes one better than another is usually a combination of new, groundbreaking materials and the novel device structure. The better the materials, and the way those materials are creatively designed to build the ultimate structure, the better the memory device is. Now, researchers have published a piece in Nature Electronics about their creation of a memory device with improved material and structure and which promises to increase data upload speed, extend smartphone battery life, and reduce data corruption.

Han Wang, associate professor of electrical and computer engineering at the University of Southern California Viterbi School of Engineering, along with postdoctoral scholar Jiangbin Wu, PhD students Hung-Yu Chen and Xiaodong Yan, have achieved this through a concept called the ferroelectric tunneling junction (FTJ).

This new memory device is part of a family known as non-volatile memory devices, meaning they can be unplugged and still retain their data, much like cell phone memory and USB flash drives. Unlike current FTJ devices, this device is comprised of asymmetric metal and semi-metallic graphene materials. By taking these materials and building them into a novel structure, they were  able to exceed the performance of all previously demonstrated FTJs while offering promising prospects for integration with silicon electronics.

Furthermore, the unique ability of these materials to approach atomic-scale thickness can eventually lead to even faster and more energy-efficient FTJ memory down the line. “These materials allow us to build devices that can potentially be scaled to atomic-scale thickness,” Wang said. “This means the voltage required to read, write, and erase data can be drastically reduced which in turn can make the memory electronics much more energy efficient.”

Wang and his fellow researchers hope that with time, their device can be scaled up and may become a replacement not just for the non-volatile memory that we see in cell phones and USB sticks, but also volatile memory like D-RAM storage devices commonly found in computers. In addition, the device may also be engineered to hold multi-bit data states within a single cell, and with its robust endurance and retention, it has promising potential for applications in in-memory computing and other computing hardware.

About the USC Viterbi School of Engineering

Engineering began at the University of Southern California in 1905. Nearly a century later, in 2004, the school was named the USC Viterbi School of Engineering, honoring alumnus Andrew J. Viterbi, inventor of the Viterbi algorithm, a key to cell phone technology and numerous data applications. The school is consistently ranked among the top engineering programs in the world. It enrolls more than 7,000 undergraduate and graduate students, taught by 188 tenured and tenure-track faculty, with more than 90 endowed chairs and professorships. The school offers comprehensive programs in all major areas of engineering, from aerospace and astronautical engineering, to biomedical, chemical, civil and environmental engineering, to computer science and materials science, and to electrical engineering, industrial and systems engineering and mechanical engineering. With annual research expenditures exceeding $207M, the school is home to the Information Science Institute and more than 45 other research centers. Its more than 50,000 alumni span the globe. USC Viterbi is also home to the pioneering distance learning program DEN@Viterbi, ranked as the top such program in the nation the last two years. USC Viterbi is the only engineering school in the nation with three top-10 USNWR rankings: Best Graduate Schools, Best Online Graduate Engineering Programs, and Best Online Information Technology Programs. 

Monday, August 17, 2009

Avail smart ticketing from Indian Railways

The Indian Railways has selected a chip technology by NXP Semiconductors, a semiconductor founded by Philips to power its contactless smart cards for automatic fare collection system. The secure microcontroller-based technology called MIFARE DESFire will be implemented across various Indian cities in the ATVMs (Automatic Ticket Vending Machines).

The user-friendly ATVMs will be rolled out across five Indian cities - New Delhi, Secunderabad, Kolkata, Bhubaneswar and Pune. Together with card and inlay-manufacturer Siepmann's Card Systems, NXP will provide MIFARE DESFire-based ICs for approximately 6.5 lakh contactless cards over a period of one year. This project is expected to be launched in September 2009 and will initially be rolled out in Delhi and Secunderabad.

The Centre for Railway Information Systems (CRIS), the IT wing of the Ministry of Railways had developed the ATVMs as part of an Unreserved Ticketing System (UTS). In 2007, CRIS developed the smart card based contactless solutions using NXP's MIFARE 1KB Classic chip in Mumbai Suburban Railway and Chennai. Over five lakh smart cards were issued to passengers in the Central/Western Railway at Mumbai and Southern Railway at Chennai.

Commenting on the implementation of smart card technology in India, Ashok Chandak, Senior Director, Global Sales and Marketing for India, NXP said, "We see a significant growth in the use of contactless Smart Card technology in transport systems in India." According to NXP, 75 percent of all electronic tickets in public transport worldwide use the NXP MIFARE technology.

Agencies

Monday, July 27, 2009

AMD Subsidiary Building $4.2 billion on New York Facility

AMD's manufacturing subsidiary -- Global Foundries is building a $4.2 billion chip manufacturing facility in upstate New York. With its new facility, the AMD spin-off will now be able to directly compete with archrivals Intel and other semiconductor manufacturers.
According to AMD semiconductor manufacturing remains expensive, and hence outsourcing will increase. However, analysts said it will be difficult for the New York chip foundry arm business (fab) to compete with Taiwanese industry leaders.

Chip manufacturers have posted significant losses in recent quarters because they have been unable to run at capacity.

AMD had launched Globalfoundries as a JV with Abu Dhabi-backed Advanced Technology Investment Company in May, a move that led to Intel accusing it of breaching a 2001 patent cross-license agreement.

The U.S. Company holds a 34.2% stake in the venture and ATIC holds the remaining 65.8%. Their New York foundry is scheduled to begin production in 2012, said the company.

CXOtoday.com

Wednesday, June 3, 2009

New lighter, power-saving Intel chips for laptops

Intel Corp has launched a lighter, power-saving microprocessor intended for use in ultra-thin laptops, a move by the top chip
maker to shore up its lead in mobile computing.

The new processor, dubbed the Pentium SU2700, comes amid investors' fears that cheaper processors such as the Atom, designed for use in ultra-cheap netbooks, are cannibalizing the market share for higher-margin, more expensive chips.

Acer and Asustek have said they will build laptops with the chip, and Microsoft will ensure its software supports it.

Intel expects that by the fourth quarter of 2009, about a fifth of its consumer shipments will be for the new-generation laptops, slimmer and more energy-efficient.

Intel is upbeat on the ultra-thin market and expects "explosive growth in 2009, very similar to the netbook growth," Intel's director of mobile platforms product marketing Uday Marty said on a conference call.

Asutek, which in 2007 pioneered the successful low-cost, no-frills netbook PC in 2007, is expected to unveil five new laptop models based on the technology this year.

Analysts say Intel's CULV platform may offer a cheaper - but virtually as powerful - alternative to the traditional processors it makes for laptops, while enabling laptops to begin to approach the diminutive size of netbooks.

Intel released three new Core 2 Duo processors and a new mobile chipset.

Agencies

Saturday, March 28, 2009

Agilent to layoff 2,700

Agilent Technologies Inc said it will lay off 2,700 workers and halt share buybacks as the scientific-instrument maker struggles with a huge drop in demand.

The company expects revenue in its electronic-measurement segment to drop 30 per cent in fiscal 2009 -- the lowest level in its 10-year history.

Revenue in its chip and board test segment is expected to fall 50 per cent from the 2008 level, and 65 per cent from its peak volume.

Agilent is cutting annual costs by $300 million in its electronic-measurement segment and by $10 million in its chip and board test segment.

The company will also suspend share buybacks for the rest of its fiscal year, which ends in October.

The 2,700 layoffs bring the number of employees who have been laid off since December 2008 to 3,800, spokeswoman Amy Flores said, marking a 20 per cent cut in workers since the end of last year.

The moves entail cash costs of about $160 million. “Business remains severely depressed, and there are no prospects for a meaningful recovery in the foreseeable future,'' Chief Executive Bill Sullivan, said in a statement released by the company.

Agencies

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