The global semiconductor revenue is on course to total $212 billion in 2009, which is a 17.1 percent decline from 2008 revenue of $255 billion reveals a report. The report by research and analysis firm Gartner says that the projection is better than the second quarter projections of a 22.4 percent decline, which shows signs of recovery in the market.
Some of the major semiconductor vendors have reported positive second quarter sequential revenue growth. Intel posted 12 percent revenue growth, while Samsung announced its revenue increased by 30 percent and Qualcomm reported a 35.7 percent increase in its mobile chip sales. "The semiconductor market has performed better than expected, as was evident when second quarter semiconductor revenue increased 17 percent in sequential sales," said Bryan Lewis, Research Vice President at Gartner.
The increasing demand for products using semiconductor was the key driver behind the growth in the market. "Consumers reacted strongly to reduced PC and LCD TV pricing as price elasticity was amazing. The industry also benefited from the China stimulus package that worked remarkably well to boost short-term demand. Governments worldwide took action quickly and extensively to avoid a meltdown and it worked," added Lewis.
Though, the outlook for 2009 has improved, Gartner also points out that all major segments of the semiconductor market are expected to report double-digit revenue declines this year. The application-specific standard product (ASSP) - the largest segment in the semiconductor market - will touch $57.2 billion in 2009, a decline of 16.5 percent over last year's revenue. The memory market is predicted to total $41 billion with a 13.5 percent decline and the microcomponents segment is forecasted to reach $39.4 billion in 2009, a 19.2 percent decline from 2008.
According to Lewis, foundries are concerned that demand may drop off more than seasonal in the fourth quarter, and it may carry into first quarter 2010. Gartner's most likely scenario is a negative five percent growth in the first quarter of 2010, as customers take a break and absorb all the devices they purchased over the previous three quarters.
Agencies
Showing posts with label semiconductor. Show all posts
Showing posts with label semiconductor. Show all posts
Thursday, August 27, 2009
Tuesday, August 18, 2009
Will IBM develop future chips with DNA?
Scientists from IBM and California Institute of Technology are trying to build the next generation chips- smaller and more powerful, with the combination of DNA and nanotechnology. The experimental breakthrough can be a step toward developing a new technique for making smaller microprocessors beyond the traditional manufacturing processes.
In the past few years, chipmakers have been able to make tinier and powerful products, but this advancement has also pushed the limits of manufacturing techniques. According to IBM, "The revolutionary method, developed at its Almaden Research Center in California and the California Institute of Technology, can help it to make computer chips from the molecule, by arranging DNA structures on the surface of manufactured semiconductor material." Microchips are mainly used in computers, mobile phones and a broad range of electronic devices and, as chipmakers compete to develop ever-smaller chips at cheaper prices, designers are struggling to cut costs.
Spike Narayan, Research Manager, IBM said, "The biological structures like DNA actually offer some very reproducible, repetitive kinds of patterns that we can actually leverage in semiconductor processes. The combination of this directed self-assembly with today's fabrication technology for high-resolution positioning of nano-objects eventually can lead to substantial savings in the most expensive and challenging part of the chip making process." This combination can also help processor designers to keep pace with Moore's Law - the 40-plus-year-old prediction by Gordon Moore that the number of transistors on a chip will double every two years.
The cost involved in shrinking features to improve performance is a limiting factor in keeping pace with Moore's Law and a concern across the semiconductor industry. Currently, the semiconductor industry is able to make processors using 22 nanometer manufacturing technology. IBM is also looking for the DNA to act as scaffolds or miniature circuit boards for the highly precise assembly of chip components, like nanotubes, nanowires and nanoparticles. After using this technique, manufacturers are likely to build 'significantly smaller' chips than has been possible with current semiconductor fabrication technology.
Agencies
In the past few years, chipmakers have been able to make tinier and powerful products, but this advancement has also pushed the limits of manufacturing techniques. According to IBM, "The revolutionary method, developed at its Almaden Research Center in California and the California Institute of Technology, can help it to make computer chips from the molecule, by arranging DNA structures on the surface of manufactured semiconductor material." Microchips are mainly used in computers, mobile phones and a broad range of electronic devices and, as chipmakers compete to develop ever-smaller chips at cheaper prices, designers are struggling to cut costs.
Spike Narayan, Research Manager, IBM said, "The biological structures like DNA actually offer some very reproducible, repetitive kinds of patterns that we can actually leverage in semiconductor processes. The combination of this directed self-assembly with today's fabrication technology for high-resolution positioning of nano-objects eventually can lead to substantial savings in the most expensive and challenging part of the chip making process." This combination can also help processor designers to keep pace with Moore's Law - the 40-plus-year-old prediction by Gordon Moore that the number of transistors on a chip will double every two years.
The cost involved in shrinking features to improve performance is a limiting factor in keeping pace with Moore's Law and a concern across the semiconductor industry. Currently, the semiconductor industry is able to make processors using 22 nanometer manufacturing technology. IBM is also looking for the DNA to act as scaffolds or miniature circuit boards for the highly precise assembly of chip components, like nanotubes, nanowires and nanoparticles. After using this technique, manufacturers are likely to build 'significantly smaller' chips than has been possible with current semiconductor fabrication technology.
Agencies
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